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Extra Large Core Shape, More Cooling Performance
The new LGA1700 socket caters for processors with larger package sizes compared to previous desktop processor generations. To ensure maximum contact and thermal transfer, Akasa has increased the contact area between the cooler core and the processor in order to maximise heat dissipation and cooling performance.
Low-Profile and Compact
Maximum heatsink height of 21.82mm which makes it perfect for low profile systems and Small Form Factor (SFF) such as Thin-Mini-ITX, Cube and HTPC cases.
Intelligent and Optimised Design
Hi-performance aluminium heatsink with an embedded 75mm fan that features intelligent PWM function, delivers as much air as needed at any given time to cool the CPU. Coupled with hi-grade thermal interface pre-applied. Ensuring that the cooler delivers outstanding cooling performance.
New and Easy Mounting Design
Perfect for the new Intel LGA1700 socket mounting pattern with extra-safe metal screws and retention plate.
Array of Compatibility
Supports common desktop motherboards such as ATX, Micro-ATX, and Mini-ITX.
• Height of the heatsink is only 21.82mm
• Embedded PWM fan with long life Enter bearing
• Intelligent PWM and silent fan
• Good airflow
Tekniset tiedot:
Socket Type: Intel® LGA1700
Dimensions: 87.2 x 85.2 x 21.8 mm (W x D x H)
Heatsink Material: Aluminium
Max TDP Support: 35W TDP
Installation: Metal screws and retention plate
Fan Dimension: Ø75 x 10mm
Fan Speed: 600-3000 RPM (PWM controlled)
Max Airflow: 23.45 CFM
Max Air Pressure: 1.81 mm-H2O
Max Noise Level: 30.75 dB(A)
Voltage Rating / Current Rating: 12V DC / 0.19A
Bearing Type: Enter Bearing (EBR)
Fan Life Expectancy: 40,000 hours / 25°C
Fan Connector: 4-Pin PWM
